Job Vacancy Package Design Engineer Singapore April 2024 Intel

Information of Job Vacancy

Title of Job : Package Design Engineer
Company Name : Intel
Placement : Singapore
Date : 30 January 2019 ---> OPEN !
Expired : No

Job Vacancy Package Design Engineer Singapore 2024 Intel. Good Afternoon for friends who are looking for job. Hopefully not despair give to find a job that appropriate with desire your needed. Indeed somewhile find a job that convenient is laborious in this year. On this occasion, the admin will give news Job Vacancy Package Design Engineer Singapore 2024 Intel. Here news more detail about Job Vacancy Package Design Engineer Singapore 2024 Intel.

Job Vacancy Package Design Engineer Singapore 2024 Intel

Here is qualifications job description that you must meet to applying Job Vacancy Package Design Engineer Singapore 2024 Intel which opened end of this month:

Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 5 years experience in the field of IC Packaging Design and Layout. Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost.....

Only participants that meet to terms above of that will be called upon to perform stage test. For that, if you are interested and meet the job candidates Job Vacancy Package Design Engineer Singapore 2024 Intel above, please submit your application before closing date.

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